A. Rough surfaces between Adhesive & Adherent
B. Irregularities present between Adherent surfaces
C. Adherent and Adhesive molecules are tangent to each other
A. A prolonged curing cycle
B. Insufficient acrylic resin monomer
D. Prolonged bench cooling after curing
A. A higher modulus of elasticity
C. Greater ductility
D. Greater toughness
E. A higher modulus of elasticity
A. Clostridium tetani
B. Clostridium difficile
C. Clostridium botulinum
A. Free living
B. Cell wall containing muramic acid
D. Unicellular
A. The stress at the proportional limit
B. The strain at the proportional limit
C. None of the above
B. The former have higher residual monomer content
C. The former have a lower molecular weight
D. The former are more porous
A. Brittleness
B. Tensile strength
D. Toughness
A. Modulus of resilience
B. Modulus of elasticity
D. Elongation
A. Newton
B. Thixotropic
C. Pseudoplastic
A. Is accomplished by soaking the casting in baking soda
C. Causes porosity in gold
D. Remove investment from gold casting
B. Chemicals
C. Heat
D. Lasers
A. Thin Palatal area
C. Porosity is uniformly distributed
D. Thin area of flanges
A. Melts at 100C
B. Still requires heat for polymerization
C. Softens at 100C
A. Hydroquinone
B. D-methyl paratolouidine
D. Benzoyl peroxide
A. Condensation polymerization
B. Addition polymerization
C. Step-growth polymerization
B. Rockwell hardness number
C. Knoop hardness number
D. Vickerss hardness number
A. High flow
C. Low contact angle
D. High adherend wetting
A. 2% to 5%
B. 0.2% to 0.5%
C. 0.3% to 0.5%
B. permanent deformation
C. Increase in stiffness
D. Fracture of the wire
B. Nature of the adherent that is crystalline or amorphous
C. Surface tension of the adherent
D. Surface texture of the adherent
A. Covalent bond
B. Ionic bond
C. Vanderval forces
A. Lack of temperature
C. Thickness of the resin
D. Packing past the dough stage
A. Cataract
B. Iritis
D. Conjunctivitis
A. VDRL
C. Widal test
D. Kahns test
B. Decrease in vertical dimension
C. Poor colour stability
D. Less polymerization shrinkage
B. Gold alloy
C. Amalgam
D. Silicate cement
A. Fluid resin technique
B. Light cured technique
C. Compression moulding technique
A. Will cure composite upto a depth of 5 millimeter thickness
B. Need no protection while in use
C. Is fiber optic
A. Scanning microscope
B. Electron microscope
C. Inverted microscope
A. Low impact strength
B. Excessive expansion
D. Excessive brittleness
A. Vander Walls Forces
B. sonic bonds
C. Hydrogen Bonds
A. Tensile strength of 60 MPa
B. Knoop hardness number 18 to 20
D. Density of 1.13 g/cm3
B. Sporing
C. Bacterial components produced by host cells
D. Budding
A. Longitudinal compressive strength
B. Horizontal compressive strength
C. Stress after rupture
A. 40 48 KHN
B. 15 20 KHN
D. 50 60 KHN
A. Resillience
B. Ultimate strength
D. Elastic limit
A. It is composed of DNA
B. It doe not contain histones
C. It is circular
A. Cl. tetanomorphum
B. Cl. sphenoids
C. All of the above
B. 4:01
C. 5:01
D. 10:01
A. a titanium
B. Chrome-cobalt-nickel
D. B titanium
A. Pseudomonas
B. Klebsiella
C. E.coli
B. Cold working
C. Anealing
D. Work hardening
B. Salmonella typhi
C. Legionella pneumophila
D. Neisseria meningitides
A. porosity
C. Water absorption
D. Tooth breakage
A. B lymphocytes
B. None of the above
C. CD 8*
A. Bonding between filler and resin
B. Bonding between filler crystals
D. Adhesion of resin particles
A. Ductility of a material
C. Ability to be stretched with permanent deformation
D. Malleability of the metal
B. Inter metallic compounds
C. Eutectic mixture
D. Peritectic mixture
A. Mechanical properties
C. Biological properties
D. Esthetic properties
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